Engineered Materials Systems (EMS)

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Printed Electronics

printed-150x150
Product Designation
Description
Typical Application/Benefit
Application Method
Electrical Resistance
Ohms/Sq/Mil
Conductive Circuitry
CI-1001
Silver ink, highly conductive
Circuit traces to electrodes, defibrillator pads, EMI
Screen Print
< 0.015
CI-2001
Carbon Ink, general purpose
Silver top coat, TENS pads, ESD
Screen Print
<20.0
Conductive Electrodes
CI-2042
Carbon ink – highly sensitive, stable
Glucose sensor electrode surface
Screen Print
<10.0
CI-4001
Silver/Silver Chloride (45%/55%)
Drug delivery
Screen or Pad Print
<0.500
CI-4002
Silver/Silver Chloride (83%/17%)
ECG/EEG pad
Screen Print
<0.050
CI-4003
Silver/Silver Chloride (31%/69%)
Drug delivery
Screen Print
<1.000
CI-4004
Silver Chloride (100%)
Mix with CI-4002 for custom ratios
Screen Print
>1.000
Conductive Adhesives
DB-1501
Silver adhesive, single component
Surface mounting or general attachments
Stencil Print
0.0004 ohm-cm
DB-1561
Silver adhesive, two component
Surface mounting or general attachments
Needle Dispense
0.003 ohm-cm
EC-9519
Encapsulant, UV curable
Encapsulate surface mount device or similar attachments
Needle Dispense
>100 Mega ohms
Dielectric Insulators
DI-7008 A/B
Insulator, solvent based heat cure
Protect electronic circuitry, blend into conductive inks
Screen Print
>1,000 Mega ohms
DI-7521
Dielectric, UV Cure
Circuitry insulation, cross-over bridge
Screen Print
>1,000 Mega ohms
Iontophoresis
CI-5002
Zinc ink, anode
Iontophoretic battery anode
Screen Print
>1 Mega ohms
Product Designation
Description
Typical Cure
Electrical Resistance
Ohms/Sq/Mil
CI-1031-7
Silver thermoset ink, highly conductive for silver jumpers or EMI/RFI printed shield pattern
10 Min. @ 300°F
<0.010
CI-2002
Carbon ink for jumpers, resistors, shunts, or copper top-coat
10 Min. @230° F.
<20.0
DB-1501
One component stencil print silver adhesive
<6 Min @285° F
0.0004 ohm-cm
CA-180
Single component needle dispense silver SMT adhesive
3 Min @ 100° C
0.00006 ohm-cm
DI-7008 A/B
Solvent based dielectric
5-10 Min. @ 230°F
>1,000 Mega ohms
DI-7521
Flexible UV curable dielectric

450 millijoules per Square Centimeter

>1,000 Mega ohms
EC-9519
UV curable encapsulant, flexible

450 millijoules per Square Centimeter

>1,000 Mega ohms
Product Designation
Description
Typical Application/Benefit
Application Method
Electrical Resistance
Ohms/Sq/Mil
Silver Buss Bars
CI-1001
Silver-vinyl ink, highly conductive, flexible
Circuit traces / Low Ω, low cost
Screen Print
< 0.015
CI-1028
Silver-polyester ink, high solids, wear resistant, fast dry
Circuit traces / fine line printable, long switch actuation life
Screen Print
< 0.020
Carbon Resistors
CI-2002 Series
Carbon inks, stable resistance
Varied resistance blends for target resistance matching
Screen Print
20 – 100,000
CI-2026 Series
Carbon inks, stable resistance, high temperature compatible thermoset
Severe environment compatible
Screen Print
20 – 1000
CI-2042
Low ohm stable resistance carbon heating element
Low resistance heating element
Screen Print
< 10
Dielectric Insulators
DI-7521
Dielectric, UV cure
Buss bar insulation, highly flexible
Screen Print
>1,000 Mega ohms
Positive Temperature Coefficient Resistor
CI-5012
Proprietary PTCR ink, 40°C shut-off temperature
Self regulating heaters, current control, sensors
Screen Print
> 50 up to 40°C, >1.5k over 40°C
CI-5012
Proprietary PTCR ink, 65°C shut-off temperature
Self regulating heaters, current control, sensors
Screen Print
> 30 up to 65°C, >3.0k over 65°C
Miscellaneous
DB-1501
Silver epoxy, single component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
DB-1561
Silver epoxy, two component
SMD attachment, low temp cure
Needle Dispense
0.003 ohm-cm
DI-7801
UV pressure sensitive adhesive
Selectively print PSA, eliminate die-cut tapes
Screen Print
>1000 Mega ohms
Product Designation
Description
Typical Application/Benefit
Application Method
Electrical Resistance
Ohms/Sq/Mil
Silver Circuit Traces
CI-1001
Silver-vinyl ink, highly conductive, flexible
Circuit traces / Low Ω, low cost
Screen Print
< 0.015
CI-1028
Silver-polyester ink, high solids, wear resistant, fast dry
Circuit traces / fine line printable, long switch actuation life
Screen Print
< 0.020
CI-1036
Silver-urethane ink, highly conductive, highly flexible
Circuit traces / lowest Ω, highly creasable
Screen Print
< 0.010
Carbon Resistors, Contact Pads
CI-2001
Carbon-vinyl ink, general purpose
Top coat for silver contacts, can blend with CI-1001 to target resistance
Screen Print
< 20
CI-2002 Series
Carbon inks, stable resistance
Varied resistance blends for target resistance matching
Screen Print
20 – 100,000
CI-2042
Carbon ink, low ohm
Low cost x-over, low ohm resistor
Screen Print
< 10
CI-5001
Nickel ink, highly wear resistant for ZIF connectors, low ohm
ZIF tail contacts and jumpers, print in one pass
Screen Print
< 5
Dielectric Insulators
DI-7502
Dielectric, UV cure
Silver trace and cross-over junction insulation, highly flexible
Screen Print
>1,000 Mega ohms
DI-7521
Dielectric, UV Cure
Silver trace and cross-over junction insulation, moisture resistant
Screen Print
>1,000 Mega ohms
DI-7009
Heat cure insulator
Silver trace insulation, highly flexible
Screen Print
>100 Mega ohms
Miscellaneous
DB-1501
Silver epoxy, single component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
DB-1561
Silver epoxy, two component
SMD attachment, low temp cure
Needle Dispense
0.003 ohm-cm
DI-7801
UV pressure sensitive adhesive
Selectively print PSA, eliminate die-cut tapes
Screen Print
>1,000 Mega ohms
DI-7511
UV spacer
Thick printing for spacer formation, good insulation for silver traces
Screen Print
>1,000 Mega ohms
CI-1035
Silver-polyester, adhesion and stress compatible with ITO coated film.
Capacitive or transparent touch switch, low temp cure
Screen Print
< 0.025
Product Designation
Description
Typical Application/Benefit
Application Method
Electrical Resistance
Ohms – cm
Silver Epoxy Adhesives
DB-1501
Silver epoxy, 1 component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
CA-180
Silver epoxy, 2 component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
DB-1561
Silver epoxy, 2 component
SMD attachment, low temp cure
Needle Dispense
0.003 ohm-cm
Under-fill Staking Compounds
UF-9526
Non-conductive under fill adhesive
SMD attachments, long dispense life
Needle Dispense
> 1,000 Mega Ohm
UF-1569
Non-conductive under fill adhesive
SMD attachments, long dispense life
Needle Dispense
> 1,000 Mega Ohm
Encapsulant
EC-9519
Non-conductive UV cure encapsulant
SMD top coat for protection
Needle Dispense
> 1,000 Mega Ohm

Microelectronics

microelectronics-150x1501
PRODUCT
DESCRIPTION
VISCOSITY (cps)
Tg – DMA
CURE
Pot Life at 25°C (hrs)
Flex Circuit and Printer Head Assembly Adhesives
357-348
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
9500
50
60 min @ 800C 5 min @ 1500C
72 Hours
357-346-5
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
20000
60
60 min @ 800C 3 min @ 1500C
72 Hours
357-284
White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance
110000
65
40 min @ 800C 1 min @ 1500C
72 Hours
357-346-5
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
20000
60
60 min @ 800C 3 min @ 1500C
72 Hours
EN-7150
Tan, low viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance, high Tg
15000
106
30 min @ 1100C
72 Hours
TYPICAL APPLICATIONS
  • COB

PRODUCTS
  • One Component Silicone
  • One Component Epoxy

PRODUCT
DESCRIPTION
VISCOSITY
Tg
CURE SCHEDULE
Shelf Life
400-30
Fast curing low viscosity glob top
30,000 cps
145 °C
3 min at 160 °C
4 months @ 25 °C
500-98
UV curable C.O.B. with good adhesion to FR-4
6,000 cps
N/A
20 sec with UV
6 months @ <25 °C
704-78
Fast curing low viscosity glob top
25,000 cps
145 °C
3 min at 160 °C
4 months @ 25 °C
408-14
General C.O.B. with high dot height
70,000 cps
142 °C
20 min at 160 °C
3 months @ 0 °C
EN 7826
High performance encapsulant with low CTE
(18 ppm)
95,000 cps
140 °C
30 min at 150 °C
6 months @ -40 °C
EN 7500 S
RT stable C.O.B. silicone with excellent adhesion
28,000 cps
-121 °C
310 min at 150 °C
3 months @ 25 °C
PRODUCT
DESCRIPTION
RESISITIVITY (ohm•cm)
Tg (˚C)
Tan Delta
Viscosity cP (5.0 rpm)
Application Method
Electrically Conductive Die Attach Adhesives
CA-105
High Tg, low cost die attach for small die and LED’s
3 x 10-4
135
11000
Dispense
DA-5845-GB
Chip on board, meets NASA outgassing requirements
2 x 10-4
65
25000
Dispense
DA-5100
General purpose chip on board die attach adhesive
5 x 10-4
115
17000
Dispense
DB-1568
Low temperature cure (90% cured 30 minutes at 800C), snap cure at 1500C plus
5 x 10-4
40
25000
Stencil print
CA-180
Low temperature cure ( cured 15 minutes at 800C), snap cure at 1500C plus (2 seconds @ 2000C)
6 x 10-5
50
12000
Dispense
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
CA-190
High thermal conductivity (20W/mK), ionically clean, long open time die attach for small die and LED
5.0 x 10-5
135
11000
Pin transfer Dispense
CA-195
Low cost, High thermal conductivity (15W/mK), ionically clean, long open time die attach for small die and LED
6.0 x 10-5
135
11000
Pin transfer Dispense
DA-5045-2
High thermal conductivity (20W/m0K) die attach for LED’s and small die
1.0 x 10-4
139
10500
Pin transfer Dispense
DA-5933A
High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s
9.0 x 10-5
107
7500
Pin transfer Dispense
TYPICAL APPLICATIONS
  • Excellent Thermal Resistance
  • Electrically-Conductive
  • UV Resistant

PRODUCTS
  • High Thermally-Conductive Silver Filled
  • Transparent, UV Resistant

PRODUCT
DESCRIPTION
VISCOSITY (cps)
5.0 rpm
Tg (°C)
CURE
Electrical Conductivity (ohm•cm)
DA-5933-A
Outstanding thermal dissipation for die attach and high power LED; 20 W/mK
7,500
135
60 min @ 175°C
9 x 10-5
DA-5887-H
Non-conductive, transparent, optically-clear material that withstands UV and blue light
8,500
110
45 min @ 175°C
1 x 1014
DA-5055
Stencil/screen printable conductive adhesion for LED display
40,000
35
10 min @ 120°C
5 x 10-4
DA-5045
High thermal conductivity for LED attach; Rapid, low temp cure and UV resistant; 20 W/mK
10,500
58
15 min at 150°C
8 x 10-5
DA-5044
Snap cure with good stability and low temperature cure capabilities
10,000
35
1 min @ 175°C
10 min @ 120°C
5 x 10-4
DA-5041
Snap cure for chip on board, LED and small die semiconductor applications
8,500
30
3 min @ 175°C
30 min @ 150°C
2 x 10-4
DA-5011
Non-conductive, transparent, optically-clear, snap cure, material that withstands UV and blue light
8,000
80
2 min @ 120°C
1 x 1014
Viscosity (CPS) NR-1000 Series
capable of thicker coatings
NR-2000 Series Consistent
Photospeed +/- 3% critical dimension target
Liquid
Photoresists for Spin Coating
500 NR-1050 NR-2050
1,000 NR-1100 NR-2100
2,000 NR-1200 NR-2200
2,500 NR-1250 N/A
3,000 N/A NR-2300
4,000 N/A NR-2400
5,000 NR-1500 NR-2500
7,000 NR-1700
(40um coating thickness capable)
NR-2700
9,000 NR-1900
(45um coating thickness capable)
N/A
Dry Film
Photresists for Laminating
Thickness (um) DF-1000 Series
Available in Thicker Films
DF-2000 Series
consistent Photospeed +/- 3% critical dimension
target
DF-3000 Series
Improved Hydrophobicity
(Additional thicknesses available on request)
10 DF-1010 N/A N/A
14 DF-1014 DF-2014 N/A
20 DF-1020 DF-2020 DF-3020
25 DF-1025 DF-2025 N/A
35 DF-1035 N/A N/A
50 DF-1050 N/A N/A
TYPICAL APPLICATIONS
  • Heat Sink
  • Lid Seal
  • Heat Dissipation

PRODUCTS
  • One Component Epoxy
  • B-Stage Materials
  • Thermal Greases

PRODUCT
DESCRIPTION
VISCOSITY (cps)
5.0 rpm
Tg (°C)
CURE
Thermal Conductivity (W/m•K)
DA-5933-A
Outstanding thermal dissipation for die attach and high power LED
7,500
135
60 min @ 175°C
20
TM-6700
Non-bleed, high temperature stable, high thermal conductivity grease
100,000
4.5
TM-6400
Two-component, 1:1 by volume low viscosity potting compound
40,000
190
120 min @ 180°C
2.0
TM-6205
Electrically-insulating, multipurpose paste adhesive with good viscosity stability
100,000
110
10 min @ 150°C
1.4
TM-6160
Low viscosity, electrically insulating adhesive for semi-conductor applications
7,000
95
45 min @ 125°C
2.0
Product
Description
Viscosity (cps)
Tg – DMA ( 0C)
Cure
Thermal Conductivity W/m0K
UV
Cure Assembly Adhesives and Encapsulants
535-32 Low viscosity epoxy adhesive/encapsulant, contains
secondary thermal cure
1,200 2 UV + 20 min @ 1100C 0.3
535-10M-1 High viscosity epoxy
adhesive/encapsulant, contains secondary thermal cure
400,000 5 UV + 20 min @ 1100C 0.3
535-18M-57 Medium viscosity with faster cure speed 75,000 5 UV 0.3

Industrial

industrial-150x1501
TYPICAL APPLICATIONS
  • Flap Wheels
  • Honing Stones
  • Abrasive Disks

PRODUCTS
  • One and Two Component Epoxy
  • Induction Curable Epoxy
  • Cyanoacrylate Adhesive

PRODUCT
DESCRIPTION
VISCOSITY (MIXED)
LAP SHEAR (AL/AL)
MIX RATIO
CURE TIME
502-04 A/B
High strength room temperature cure epoxy for flap wheel assembly
27,000 cps
>2,500 psi
1 to 1 PBV
1 Hour
503-18 A/ 600-92 B
High peel strength room temperature cure epoxy
35,000 cps
>2,500 psi
1 to 1 PBV
4 Hours
504-78
Very low viscosity one component heat cure epoxy
3,000 cps
>2,500 psi
N/A
30 min @ 160°C
702-98
High strength non-sag one component
Paste
>3,200 psi
N/A
 10 min @ 160°C
A 400-76-1 Type
High performance one component for metal button disposable disk constructions
40,000 cps
>4000 psi
N/A
30 min @ 120°C
Induction Cure Epoxy
High performance induction curable one component for metal button disposable disk constructions
40,000 cps
>3,000 psi
N/A
1-2 min
Cyanoacrylate
High performance one component for plastic button disposable disk constructions
500-5,000 cps
>2,000 psi
N/A
2-5 min
TYPICAL APPLICATIONS
  • End Cap Bonding
  • Side Seam Assembly
  • Molded End Caps

PRODUCTS
  • One Component Epoxy
  • Two Component Epoxy
  • Two Component Silicone

PRODUCT
DESCRIPTION
VISCOSITY (MIXED)
LAP SHEAR
CURE
SCHEDULE
OPERATING TEMP.
200-26-2
Toughened one component with excellent chemical resistance
50,000 cps
3,200 psi
10 min @ 160°C
-40 to 177 °C
702-97
Fast curing one component with low viscosity
25,000 cps
3,000 psi
3 min @ 160°C
-55 to 160 °C
703-25
Highly filled one component epoxy with low exotherm
60,000 cps
3,750 psi
20 min @ 177°C
-40 to 177 °C
400-85
Non-sag thixotropic epoxy with excellent chemical resistance
Paste
3,799 psi
20 min @ 150°C
-40 to 177 °C
704-93 A/B
Two component epoxy for end cap bonding
7,000 cps
N/A
<24 hrs @ RT
-40 to 150 °C
801-1002 A/B
55 Shore D two component silicone for end cap bonding and potting
9,000 cps
525 psi
7 hrs @ RT
-48 to 232 °C
TYPICAL APPLICATIONS
  • Lens To Reflector
  • Halogen Lamp Coating
  • Base Bonding

PRODUCTS
  • One and Two Component Epoxy
  • One Component Silicone
  • Black Top Coatings

PRODUCT
DESCRIPTION
VISCOSITY
LAP SHEAR (AL/AL)
CURE SCHEDULE
OPERATING TEMP
200-56
Heat resistant one component epoxy for lens bonding
Non-sag paste
2,500 psi
5 min at 150°C
-40 to 200°C
502-61
Toughened and flexible 54 Shore D one component epoxy for eyelet and lens bonding
Non-sag paste
4,900 psi
20 min at 135°C
-65 to 160°C
504-42
High temperature one component silicone for lens bonding
Non-sag paste
550 psi
15 min at 200°C
-50 to 250°C
504-94
High temperature one component silicone adhesive designed for low cost lens bonding
Non-sag paste
450 psi
15 min at 200°C
-50 to 250°C
703-15
High temperature resistant black top bulb coating
550 cps
 N/A
Ramp from 90°C to 300°C
-65 to 450°C
500-93
High strength UV adhesive with low shrinkage
12,000 cps
2,000 psi
10 sec with UV
-40 to 150°C
703-60
Flexible 45 Shore D one component epoxy for eyelet and lens bonding
Non-sag paste
 2,000 psi
15 min at 150°C
-65 to 160°C
PRODUCT
DESCRIPTION
VISCOSITY (MIXED)
DENSITY
CURE SCHEDULE
UV 9014**
Optically clear moisture resistant needle bonder
5,000 cps
9.2 Lb/Gal
1-3 sec. at 100 mW/cm2
UV 9019V**
Flexible high impact resistant needle bonder
4,000 cps
9.2 Lb/Gali
5-10 sec. at 100 mW/cm2
200-51
Highest viscosity needle epoxy
30,000 cps
1.7
30 min. at 100°C
25 min at 125°C
200-51 TS
Higher thixotropy version of 200-51
24,000 cps
1.3
30 min. at 100°C
25 min at 125°C
TYPICAL APPLICATIONS
  • Power Supplies
  • Transformers
  • Sensors

PRODUCTS
  • One and Two Component Epoxy
  • Two Component Silicone Adhesive
  • UV Curable

PRODUCT DESCRIPTION VISCOSITY (MIXED) HARDNESS/
COLOR
GEL/CURE TIME MIX RATIO (pbw)
703-73 A/B
Low viscosity marine electronics fast curing epoxy
5,000 cps
38 D/Black
4 min/ 3 hrs
@ 25°C
100:75
704-93 A/B
Equal mix low viscosity RT cure epoxy for electronics
11,000 cps
70 D/Dark Gray
60 min/ 24 hrs @ 25°C
100:100
504-83 A/B
Low viscosity thermally conductive two part silicone
16,000 cps
60 A/Gray
5 hrs/ 3 hrs
@ 65°C
100:100
505-07 A/B
Equal mix blush free potting compound pending UL approval
25,000 cps
82 D/Black
45 min/ 24 hrs @ 25°C
100:100
505-06 FR
General one component potting compound pending UL
45,000 cps
85 D/Black
10 min
@ 177°C
N/A
UV 9052 A/B
Two part dual cure general potting UV with good adhesion to metal, glass, and plastic
150
85 D/Clear
UV + RT
100:100
501-5A/600-46B

Glossy black UL 94V-O low viscosity RT cure epoxy for electronics and PC boards

5,000 cps
85 D/Glossy Black
1 hr/ <8 hrs
@ 25°C
100:25
SP 2059 A/ 600-72 B
UL 94V-O low viscosity RT cure epoxy for electronics
14,500 cps
85 D/White
45 min/ 24 Hr @ 25°C
100:11
702-96 A/ 600-80 B
UL 94V-O low viscosity heat cure epoxy for electronics
9,000 cps
80 D/Black
24 hr/ 1hr
@ 100°C
100:15
400-64 A/ 600-09 B
RT cure UL 94V-O medium viscosity thermally conductive epoxy
180,000 cps
92 D/Black
45 min/ 20 hrs @ 25°C
 100:30
505-06 FR
General one component potting compound pending UL approval
45,000 cps
85 D/Black
10 min
@ 177°C
N/A
505-07 A/B
Equal mix blush free potting compound pending UL approval
25,000 cps
82 D/Black
45 min/ 24 hrs
100:100
SP 2001A/ 600-72 B
UL 94V-O low viscosity potting compound
8,000 cps
85 D/Black
45 min/ 24 hrs @ 25°C
100:12
400-87 A/B
Ultra fast curing equal mix epoxy with low viscosity and low shrinkage
12,000 cps
75 D/Clear
75 sec/ 7 min @ 25°C
 100:100
TYPICAL APPLICATIONS
  • Magnet to Shell/Rotor
  • Gel Banding
  • Balancing

PRODUCTS
  • One and Two Component Epoxy
  • One Component Induction Curable Epoxy
  • Surface Activated Reactive Acrylic

PRODUCT
DESCRIPTION
VISCOSITY
LAP SHEAR (AL/AL)
CURE SCHEDULE
OPERATING TEMP
400-76-1
High strength low stress one component epoxy
100,000 cps
5,900 psi
30 min at 150°C
-40 to 180°C
AC 109/SVF
Two component surface activated acrylic
12,000 cps
2,500 psi
1 min at 25°C
-54 to 150°C
502-09
High temperature resistant one component epoxy
Paste
3,100 psi
30 min at 160°C
-40 to 220°C
502-61
Toughened and flexible 54 Shore D epoxy
Paste
4,930 psi
12 min at 150°C
-65 to 160°C
702-80-1
Non-metallic filled one component epoxy
Paste
4,000 psi
20 min at 150°C
-40 to 200°C
702-98
Induction curable one component epoxy
Paste
3,200 psi
2 min at 150°C
-40 to 200°C
704-39
Fast curing version version of 702-98
Paste
3,200 psi
2 min at 150°C
-40 to 200°C
704-08
Medium viscosity epoxy for gel banding
140,000 cps
 2,500 psi
4 min at 150°C
-40 to 180°C
PRODUCT
DESCRIPTION
VISCOSITY (MIXED)
HARDNESS/COLOR
GEL/CURE TIME
MIX RATIO (A:B)
505-82 A/B
Low viscosity potting compound with excellent adhesion to a variety of substrates
7,500 cps
70 D/Black
110 min / 24 hrs at 25°C
1:1 pbv
702-96 A/ 600-80 B
UL 94V-O low viscosity heat cure epoxy for electronics
9,000 cps
80 D/Black
24 hrs. /1 hr at 100°C
‘100:15 pbw
400-64-1A FR / 600-09 B
RT cure UL 94V-O medium viscosity thermally conductive epoxy
190,000 cps
92 D/Black
45 min. / 20 hrs at 25°C
‘100:3 pbw

Solar

solar-150x150
Product Description Resistivity (ohm•cm) Tg (˚C)
Tan Delta
Viscosity cP (5.0 s-1) Application Method
Conductive
Ribbon/Stringer Attach Adhesives
DB-1538-2 2 part, 2 min @180˚C cure 2 x 10-4 50 11,000 Meter-mix Dispense
DB-1541-S3 Lower silver content (lower cost) than DB-1541-S
with same reliability, conductivity
1 x 10-4 0 10,000 Needle Dispense
DB-1548-1 High shear strength, moderate Tg Conductivity
stability on tin and tin-silver ribbon
3 x 10-4 60 10,000 Needle Dispense
CA-100 High Tg conductive adhesive developed for glass
backed thin film stringing applications. Good damp heat stability on
molybdenum
4 x 10-4 110 20,000 Needle Dispense
Low Cost
Conductive Adhesives
CA-105 Low cost, high Tg, good damp heat stability on tin,
silver and OSP treated copper
3 x 10-4 135 11,000 Needle Dispense
CA-141 Low cost version of DB-1541-S series. Flexible, low
Tg
2 x 10-4 10 20,000 Needle Dispense
CA-148 Low cost jettable version of DB-1541-S, moderate
Tg/flexibility
4 x 10-4 30 10,000 Jet Dispense
CA-161 Low cost, moderate Tg material for ribbon stringing
applications
2 x 10-4 50 12,000 Needle Dispense
CA-175 Snap cure, low cost, medium modulus 2 x 10-4 130 18,000 Needle Dispense
DB-1590 Low cost, fast/snap cure. Designed for ribbon
stringing for crystralline silicon or thin film cells
2 x 10-4 15 20,000 Needle Dispense
Low
Temperature Cure Conductive Adhesives
DB-1541-LTC Low temperature cure version (100C) for organic PV
and other temperature sensitive modules
2
x 10-4
50 17,000 Needle Dispense
CA-180 Low temperature cure ( cured 15 minutes at 800C), snap cure at 1500C
plus (2 seconds @ 2000C)
6 x 10-5 50 12,000 Needle Dispense
Product Description Resistivity (ohm•cm) Tg (˚C)
Tan Delta
Viscosity cP (5.0 s-1) Application Method
Conductive
Adhesives for Back Contact Applications
DB-1541 Flexible, high peel strength, Damp heat stability
on tin and OSP treated copper. Designed to cure during EVA lamination
1 x 10-4 13 33,000 Stencil Print
DB-1588-1 Lowest cost, flexible, excellent damp heat
performance on OSP treated copper.
4 x 10-4 5 30,000 Stencil Print
DB-1588-2 Low cost, flexible, excellent damp heat performance
on OSP treated copper. Lowest cost.
4 x 10-4 5 30,000 Stencil Print
DB-1588-3 Needle dispensible or jet version of DB-1588-4 2 x 10-4 0 20,000 Needle Dispense, Jet
DB-1588-4 Lowest cost of the DB-1588-series materials. Faster
cure for fast cure EVA encapsulants
2 x 10-4 0 35,000 Stencil Print
DB-1588-5 Slower cure for longer laminations 2 x 10-4 0 35,000 Stencil Print
DB-1588-6 Designed for jet or needle dispensing 3 x 10-4 -15 11,000 Jet Dispensing