Engineered Materials Systems, Inc, is a global formulator and manufacturer of adhesives, conductives and encapsulants serving the appliance, automotive, filter, lighting, medical and microelectronics markets. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes. EMS’s goal is to fill a void in the industrial market utilizing materials for assembly. EMS believes all applications are unique and specific.
EMS is a market leader providing innovative and cost effective solutions for original equipment manufacturers. Our customer commitment is another reason why EMS maintains market leadership in providing excellent engineered materials.
Printed Electronics
|
Product Designation
|
Description
|
Typical Application/Benefit
|
Application Method
|
Electrical Resistance
Ohms/Sq/Mil |
|
|---|---|---|---|---|---|
| Conductive Circuitry | |||||
|
CI-1001
|
Silver ink, highly conductive
|
Circuit traces to electrodes, defibrillator pads, EMI
|
Screen Print
|
< 0.015
|
|
|
CI-2001
|
Carbon Ink, general purpose
|
Silver top coat, TENS pads, ESD
|
Screen Print
|
<20.0
|
|
| Conductive Electrodes | |||||
|
CI-2042
|
Carbon ink – highly sensitive, stable
|
Glucose sensor electrode surface
|
Screen Print
|
<10.0
|
|
|
CI-4001
|
Silver/Silver Chloride (45%/55%)
|
Drug delivery
|
Screen or Pad Print
|
<0.500
|
|
|
CI-4002
|
Silver/Silver Chloride (83%/17%)
|
ECG/EEG pad
|
Screen Print
|
<0.050
|
|
|
CI-4003
|
Silver/Silver Chloride (31%/69%)
|
Drug delivery
|
Screen Print
|
<1.000
|
|
|
CI-4004
|
Silver Chloride (100%)
|
Mix with CI-4002 for custom ratios
|
Screen Print
|
>1.000
|
|
| Conductive Adhesives | |||||
|
DB-1501
|
Silver adhesive, single component
|
Surface mounting or general attachments
|
Stencil Print
|
0.0004 ohm-cm
|
|
|
DB-1561
|
Silver adhesive, two component
|
Surface mounting or general attachments
|
Needle Dispense
|
0.003 ohm-cm
|
|
|
EC-9519
|
Encapsulant, UV curable
|
Encapsulate surface mount device or similar attachments
|
Needle Dispense
|
>100 Mega ohms
|
|
| Dielectric Insulators | |||||
|
DI-7008 A/B
|
Insulator, solvent based heat cure
|
Protect electronic circuitry, blend into conductive inks
|
Screen Print
|
>1,000 Mega ohms
|
|
|
DI-7521
|
Dielectric, UV Cure
|
Circuitry insulation, cross-over bridge
|
Screen Print
|
>1,000 Mega ohms
|
|
| Iontophoresis | |||||
|
CI-5002
|
Zinc ink, anode
|
Iontophoretic battery anode
|
Screen Print
|
>1 Mega ohms
|
|
|
Product Designation
|
Description
|
Typical Cure
|
Electrical Resistance
Ohms/Sq/Mil |
|---|---|---|---|
|
CI-1031-7
|
Silver thermoset ink, highly conductive for silver jumpers or EMI/RFI printed shield pattern
|
10 Min. @ 300°F
|
<0.010
|
|
CI-2002
|
Carbon ink for jumpers, resistors, shunts, or copper top-coat
|
10 Min. @230° F.
|
<20.0
|
|
DB-1501
|
One component stencil print silver adhesive
|
<6 Min @285° F
|
0.0004 ohm-cm
|
|
CA-180
|
Single component needle dispense silver SMT adhesive
|
3 Min @ 100° C
|
0.00006 ohm-cm
|
|
DI-7008 A/B
|
Solvent based dielectric
|
5-10 Min. @ 230°F
|
>1,000 Mega ohms
|
|
DI-7521
|
Flexible UV curable dielectric
|
450 millijoules per Square Centimeter |
>1,000 Mega ohms
|
|
EC-9519
|
UV curable encapsulant, flexible
|
450 millijoules per Square Centimeter |
>1,000 Mega ohms
|
|
Product Designation
|
Description
|
Typical Application/Benefit
|
Application Method
|
Electrical Resistance
Ohms/Sq/Mil |
|
|---|---|---|---|---|---|
| Silver Buss Bars | |||||
|
CI-1001
|
Silver-vinyl ink, highly conductive, flexible
|
Circuit traces / Low Ω, low cost
|
Screen Print
|
< 0.015
|
|
|
CI-1028
|
Silver-polyester ink, high solids, wear resistant, fast dry
|
Circuit traces / fine line printable, long switch actuation life
|
Screen Print
|
< 0.020
|
|
| Carbon Resistors | |||||
|
CI-2002 Series
|
Carbon inks, stable resistance
|
Varied resistance blends for target resistance matching
|
Screen Print
|
20 – 100,000
|
|
|
CI-2026 Series
|
Carbon inks, stable resistance, high temperature compatible thermoset
|
Severe environment compatible
|
Screen Print
|
20 – 1000
|
|
|
CI-2042
|
Low ohm stable resistance carbon heating element
|
Low resistance heating element
|
Screen Print
|
< 10
|
|
| Dielectric Insulators | |||||
|
DI-7521
|
Dielectric, UV cure
|
Buss bar insulation, highly flexible
|
Screen Print
|
>1,000 Mega ohms
|
|
| Positive Temperature Coefficient Resistor | |||||
|
CI-5012
|
Proprietary PTCR ink, 40°C shut-off temperature
|
Self regulating heaters, current control, sensors
|
Screen Print
|
> 50 up to 40°C, >1.5k over 40°C
|
|
|
CI-5012
|
Proprietary PTCR ink, 65°C shut-off temperature
|
Self regulating heaters, current control, sensors
|
Screen Print
|
> 30 up to 65°C, >3.0k over 65°C
|
|
| Miscellaneous | |||||
|
DB-1501
|
Silver epoxy, single component
|
SMD attachments, high shear strength, long stencil life
|
Stencil Print
|
0.0004 ohm-cm
|
|
|
DB-1561
|
Silver epoxy, two component
|
SMD attachment, low temp cure
|
Needle Dispense
|
0.003 ohm-cm
|
|
|
DI-7801
|
UV pressure sensitive adhesive
|
Selectively print PSA, eliminate die-cut tapes
|
Screen Print
|
>1000 Mega ohms
|
|
|
Product Designation
|
Description
|
Typical Application/Benefit
|
Application Method
|
Electrical Resistance
Ohms/Sq/Mil |
|
|---|---|---|---|---|---|
| Silver Circuit Traces | |||||
|
CI-1001
|
Silver-vinyl ink, highly conductive, flexible
|
Circuit traces / Low Ω, low cost
|
Screen Print
|
< 0.015
|
|
|
CI-1028
|
Silver-polyester ink, high solids, wear resistant, fast dry
|
Circuit traces / fine line printable, long switch actuation life
|
Screen Print
|
< 0.020
|
|
|
CI-1036
|
Silver-urethane ink, highly conductive, highly flexible
|
Circuit traces / lowest Ω, highly creasable
|
Screen Print
|
< 0.010
|
|
| Carbon Resistors, Contact Pads | |||||
|
CI-2001
|
Carbon-vinyl ink, general purpose
|
Top coat for silver contacts, can blend with CI-1001 to target resistance
|
Screen Print
|
< 20
|
|
|
CI-2002 Series
|
Carbon inks, stable resistance
|
Varied resistance blends for target resistance matching
|
Screen Print
|
20 – 100,000
|
|
|
CI-2042
|
Carbon ink, low ohm
|
Low cost x-over, low ohm resistor
|
Screen Print
|
< 10
|
|
|
CI-5001
|
Nickel ink, highly wear resistant for ZIF connectors, low ohm
|
ZIF tail contacts and jumpers, print in one pass
|
Screen Print
|
< 5
|
|
| Dielectric Insulators | |||||
|
DI-7502
|
Dielectric, UV cure
|
Silver trace and cross-over junction insulation, highly flexible
|
Screen Print
|
>1,000 Mega ohms
|
|
|
DI-7521
|
Dielectric, UV Cure
|
Silver trace and cross-over junction insulation, moisture resistant
|
Screen Print
|
>1,000 Mega ohms
|
|
|
DI-7009
|
Heat cure insulator
|
Silver trace insulation, highly flexible
|
Screen Print
|
>100 Mega ohms
|
|
| Miscellaneous | |||||
|
DB-1501
|
Silver epoxy, single component
|
SMD attachments, high shear strength, long stencil life
|
Stencil Print
|
0.0004 ohm-cm
|
|
|
DB-1561
|
Silver epoxy, two component
|
SMD attachment, low temp cure
|
Needle Dispense
|
0.003 ohm-cm
|
|
|
DI-7801
|
UV pressure sensitive adhesive
|
Selectively print PSA, eliminate die-cut tapes
|
Screen Print
|
>1,000 Mega ohms
|
|
|
DI-7511
|
UV spacer
|
Thick printing for spacer formation, good insulation for silver traces
|
Screen Print
|
>1,000 Mega ohms
|
|
|
CI-1035
|
Silver-polyester, adhesion and stress compatible with ITO coated film.
|
Capacitive or transparent touch switch, low temp cure
|
Screen Print
|
< 0.025
|
|
|
Product Designation
|
Description
|
Typical Application/Benefit
|
Application Method
|
Electrical Resistance
Ohms – cm |
|
|---|---|---|---|---|---|
| Silver Epoxy Adhesives | |||||
|
DB-1501
|
Silver epoxy, 1 component
|
SMD attachments, high shear strength, long stencil life
|
Stencil Print
|
0.0004 ohm-cm
|
|
|
CA-180
|
Silver epoxy, 2 component
|
SMD attachments, high shear strength, long stencil life
|
Stencil Print
|
0.0004 ohm-cm
|
|
|
DB-1561
|
Silver epoxy, 2 component
|
SMD attachment, low temp cure
|
Needle Dispense
|
0.003 ohm-cm
|
|
| Under-fill Staking Compounds | |||||
|
UF-9526
|
Non-conductive under fill adhesive
|
SMD attachments, long dispense life
|
Needle Dispense
|
> 1,000 Mega Ohm
|
|
|
UF-1569
|
Non-conductive under fill adhesive
|
SMD attachments, long dispense life
|
Needle Dispense
|
> 1,000 Mega Ohm
|
|
| Encapsulant | |||||
|
EC-9519
|
Non-conductive UV cure encapsulant
|
SMD top coat for protection
|
Needle Dispense
|
> 1,000 Mega Ohm
|
|
Microelectronics
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (cps)
|
Tg – DMA
|
CURE
|
Pot Life at 25°C (hrs)
|
|---|---|---|---|---|---|
| Flex Circuit and Printer Head Assembly Adhesives | |||||
|
357-348
|
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
|
9500
|
50
|
60 min @ 800C 5 min @ 1500C
|
72 Hours
|
|
357-346-5
|
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
|
20000
|
60
|
60 min @ 800C 3 min @ 1500C
|
72 Hours
|
|
357-284
|
White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance
|
110000
|
65
|
40 min @ 800C 1 min @ 1500C
|
72 Hours
|
|
357-346-5
|
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
|
20000
|
60
|
60 min @ 800C 3 min @ 1500C
|
72 Hours
|
|
EN-7150
|
Tan, low viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance, high Tg
|
15000
|
106
|
30 min @ 1100C
|
72 Hours
|
TYPICAL APPLICATIONS
- COB
PRODUCTS
- One Component Silicone
- One Component Epoxy
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
Tg
|
CURE SCHEDULE
|
Shelf Life
|
|---|---|---|---|---|---|
|
400-30
|
Fast curing low viscosity glob top
|
30,000 cps
|
145 °C
|
3 min at 160 °C
|
4 months @ 25 °C
|
|
500-98
|
UV curable C.O.B. with good adhesion to FR-4
|
6,000 cps
|
N/A
|
20 sec with UV
|
6 months @ <25 °C
|
|
704-78
|
Fast curing low viscosity glob top
|
25,000 cps
|
145 °C
|
3 min at 160 °C
|
4 months @ 25 °C
|
|
408-14
|
General C.O.B. with high dot height
|
70,000 cps
|
142 °C
|
20 min at 160 °C
|
3 months @ 0 °C
|
|
EN 7826
|
High performance encapsulant with low CTE
(18 ppm) |
95,000 cps
|
140 °C
|
30 min at 150 °C
|
6 months @ -40 °C
|
|
EN 7500 S
|
RT stable C.O.B. silicone with excellent adhesion
|
28,000 cps
|
-121 °C
|
310 min at 150 °C
|
3 months @ 25 °C
|
|
PRODUCT
|
DESCRIPTION
|
RESISITIVITY (ohm•cm)
|
Tg (˚C)
Tan Delta |
Viscosity cP (5.0 rpm)
|
Application Method
|
|---|---|---|---|---|---|
|
Electrically Conductive Die Attach Adhesives
|
|||||
|
CA-105
|
High Tg, low cost die attach for small die and LED’s
|
3 x 10-4
|
135
|
11000
|
Dispense
|
|
DA-5845-GB
|
Chip on board, meets NASA outgassing requirements
|
2 x 10-4
|
65
|
25000
|
Dispense
|
|
DA-5100
|
General purpose chip on board die attach adhesive
|
5 x 10-4
|
115
|
17000
|
Dispense
|
|
DB-1568
|
Low temperature cure (90% cured 30 minutes at 800C), snap cure at 1500C plus
|
5 x 10-4
|
40
|
25000
|
Stencil print
|
|
CA-180
|
Low temperature cure ( cured 15 minutes at 800C), snap cure at 1500C plus (2 seconds @ 2000C)
|
6 x 10-5
|
50
|
12000
|
Dispense
|
|
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
|
|||||
|
CA-190
|
High thermal conductivity (20W/mK), ionically clean, long open time die attach for small die and LED
|
5.0 x 10-5
|
135
|
11000
|
Pin transfer Dispense
|
|
CA-195
|
Low cost, High thermal conductivity (15W/mK), ionically clean, long open time die attach for small die and LED
|
6.0 x 10-5
|
135
|
11000
|
Pin transfer Dispense
|
|
DA-5045-2
|
High thermal conductivity (20W/m0K) die attach for LED’s and small die
|
1.0 x 10-4
|
139
|
10500
|
Pin transfer Dispense
|
|
DA-5933A
|
High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s
|
9.0 x 10-5
|
107
|
7500
|
Pin transfer Dispense
|
TYPICAL APPLICATIONS
- Excellent Thermal Resistance
- Electrically-Conductive
- UV Resistant
PRODUCTS
- High Thermally-Conductive Silver Filled
- Transparent, UV Resistant
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (cps)
5.0 rpm |
Tg (°C)
|
CURE
|
Electrical Conductivity (ohm•cm)
|
|---|---|---|---|---|---|
|
DA-5933-A
|
Outstanding thermal dissipation for die attach and high power LED; 20 W/mK
|
7,500
|
135
|
60 min @ 175°C
|
9 x 10-5
|
|
DA-5887-H
|
Non-conductive, transparent, optically-clear material that withstands UV and blue light
|
8,500
|
110
|
45 min @ 175°C
|
1 x 1014
|
|
DA-5055
|
Stencil/screen printable conductive adhesion for LED display
|
40,000
|
35
|
10 min @ 120°C
|
5 x 10-4
|
|
DA-5045
|
High thermal conductivity for LED attach; Rapid, low temp cure and UV resistant; 20 W/mK
|
10,500
|
58
|
15 min at 150°C
|
8 x 10-5
|
|
DA-5044
|
Snap cure with good stability and low temperature cure capabilities
|
10,000
|
35
|
1 min @ 175°C
10 min @ 120°C |
5 x 10-4
|
|
DA-5041
|
Snap cure for chip on board, LED and small die semiconductor applications
|
8,500
|
30
|
3 min @ 175°C
30 min @ 150°C |
2 x 10-4
|
|
DA-5011
|
Non-conductive, transparent, optically-clear, snap cure, material that withstands UV and blue light
|
8,000
|
80
|
2 min @ 120°C
|
1 x 1014
|
| Viscosity (CPS) | NR-1000 Series capable of thicker coatings |
NR-2000 Series Consistent Photospeed +/- 3% critical dimension target |
|
|---|---|---|---|
| Liquid Photoresists for Spin Coating |
|||
| 500 | NR-1050 | NR-2050 | |
| 1,000 | NR-1100 | NR-2100 | |
| 2,000 | NR-1200 | NR-2200 | |
| 2,500 | NR-1250 | N/A | |
| 3,000 | N/A | NR-2300 | |
| 4,000 | N/A | NR-2400 | |
| 5,000 | NR-1500 | NR-2500 | |
| 7,000 | NR-1700 (40um coating thickness capable) |
NR-2700 | |
| 9,000 | NR-1900 (45um coating thickness capable) |
N/A | |
| Dry Film Photresists for Laminating |
|||
| Thickness (um) | DF-1000 Series Available in Thicker Films |
DF-2000 Series consistent Photospeed +/- 3% critical dimension target |
DF-3000 Series Improved Hydrophobicity (Additional thicknesses available on request) |
| 10 | DF-1010 | N/A | N/A |
| 14 | DF-1014 | DF-2014 | N/A |
| 20 | DF-1020 | DF-2020 | DF-3020 |
| 25 | DF-1025 | DF-2025 | N/A |
| 35 | DF-1035 | N/A | N/A |
| 50 | DF-1050 | N/A | N/A |
TYPICAL APPLICATIONS
- Heat Sink
- Lid Seal
- Heat Dissipation
PRODUCTS
- One Component Epoxy
- B-Stage Materials
- Thermal Greases
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (cps)
5.0 rpm |
Tg (°C)
|
CURE
|
Thermal Conductivity (W/m•K)
|
|---|---|---|---|---|---|
|
DA-5933-A
|
Outstanding thermal dissipation for die attach and high power LED
|
7,500
|
135
|
60 min @ 175°C
|
20
|
|
TM-6700
|
Non-bleed, high temperature stable, high thermal conductivity grease
|
100,000
|
—
|
—
|
4.5
|
|
TM-6400
|
Two-component, 1:1 by volume low viscosity potting compound
|
40,000
|
190
|
120 min @ 180°C
|
2.0
|
|
TM-6205
|
Electrically-insulating, multipurpose paste adhesive with good viscosity stability
|
100,000
|
110
|
10 min @ 150°C
|
1.4
|
|
TM-6160
|
Low viscosity, electrically insulating adhesive for semi-conductor applications
|
7,000
|
95
|
45 min @ 125°C
|
2.0
|
|
Product
|
Description
|
Viscosity (cps)
|
Tg – DMA ( 0C)
|
Cure
|
Thermal Conductivity W/m0K
|
|---|---|---|---|---|---|
| UV Cure Assembly Adhesives and Encapsulants |
|||||
| 535-32 | Low viscosity epoxy adhesive/encapsulant, contains secondary thermal cure |
1,200 | 2 | UV + 20 min @ 1100C | 0.3 |
| 535-10M-1 | High viscosity epoxy adhesive/encapsulant, contains secondary thermal cure |
400,000 | 5 | UV + 20 min @ 1100C | 0.3 |
| 535-18M-57 | Medium viscosity with faster cure speed | 75,000 | 5 | UV | 0.3 |
Industrial
TYPICAL APPLICATIONS
- Flap Wheels
- Honing Stones
- Abrasive Disks
PRODUCTS
- One and Two Component Epoxy
- Induction Curable Epoxy
- Cyanoacrylate Adhesive
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (MIXED)
|
LAP SHEAR (AL/AL)
|
MIX RATIO
|
CURE TIME
|
|---|---|---|---|---|---|
|
502-04 A/B
|
High strength room temperature cure epoxy for flap wheel assembly
|
27,000 cps
|
>2,500 psi
|
1 to 1 PBV
|
1 Hour
|
|
503-18 A/ 600-92 B
|
High peel strength room temperature cure epoxy
|
35,000 cps
|
>2,500 psi
|
1 to 1 PBV
|
4 Hours
|
|
504-78
|
Very low viscosity one component heat cure epoxy
|
3,000 cps
|
>2,500 psi
|
N/A
|
30 min @ 160°C
|
|
702-98
|
High strength non-sag one component
|
Paste
|
>3,200 psi
|
N/A
|
10 min @ 160°C
|
|
A 400-76-1 Type
|
High performance one component for metal button disposable disk constructions
|
40,000 cps
|
>4000 psi
|
N/A
|
30 min @ 120°C
|
|
Induction Cure Epoxy
|
High performance induction curable one component for metal button disposable disk constructions
|
40,000 cps
|
>3,000 psi
|
N/A
|
1-2 min
|
|
Cyanoacrylate
|
High performance one component for plastic button disposable disk constructions
|
500-5,000 cps
|
>2,000 psi
|
N/A
|
2-5 min
|
TYPICAL APPLICATIONS
- End Cap Bonding
- Side Seam Assembly
- Molded End Caps
PRODUCTS
- One Component Epoxy
- Two Component Epoxy
- Two Component Silicone
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (MIXED)
|
LAP SHEAR
|
CURE
SCHEDULE |
OPERATING TEMP.
|
|---|---|---|---|---|---|
|
200-26-2
|
Toughened one component with excellent chemical resistance
|
50,000 cps
|
3,200 psi
|
10 min @ 160°C
|
-40 to 177 °C
|
|
702-97
|
Fast curing one component with low viscosity
|
25,000 cps
|
3,000 psi
|
3 min @ 160°C
|
-55 to 160 °C
|
|
703-25
|
Highly filled one component epoxy with low exotherm
|
60,000 cps
|
3,750 psi
|
20 min @ 177°C
|
-40 to 177 °C
|
|
400-85
|
Non-sag thixotropic epoxy with excellent chemical resistance
|
Paste
|
3,799 psi
|
20 min @ 150°C
|
-40 to 177 °C
|
|
704-93 A/B
|
Two component epoxy for end cap bonding
|
7,000 cps
|
N/A
|
<24 hrs @ RT
|
-40 to 150 °C
|
|
801-1002 A/B
|
55 Shore D two component silicone for end cap bonding and potting
|
9,000 cps
|
525 psi
|
7 hrs @ RT
|
-48 to 232 °C
|
TYPICAL APPLICATIONS
- Lens To Reflector
- Halogen Lamp Coating
- Base Bonding
PRODUCTS
- One and Two Component Epoxy
- One Component Silicone
- Black Top Coatings
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
LAP SHEAR (AL/AL)
|
CURE SCHEDULE
|
OPERATING TEMP
|
|---|---|---|---|---|---|
|
200-56
|
Heat resistant one component epoxy for lens bonding
|
Non-sag paste
|
2,500 psi
|
5 min at 150°C
|
-40 to 200°C
|
|
502-61
|
Toughened and flexible 54 Shore D one component epoxy for eyelet and lens bonding
|
Non-sag paste
|
4,900 psi
|
20 min at 135°C
|
-65 to 160°C
|
|
504-42
|
High temperature one component silicone for lens bonding
|
Non-sag paste
|
550 psi
|
15 min at 200°C
|
-50 to 250°C
|
|
504-94
|
High temperature one component silicone adhesive designed for low cost lens bonding
|
Non-sag paste
|
450 psi
|
15 min at 200°C
|
-50 to 250°C
|
|
703-15
|
High temperature resistant black top bulb coating
|
550 cps
|
N/A
|
Ramp from 90°C to 300°C
|
-65 to 450°C
|
|
500-93
|
High strength UV adhesive with low shrinkage
|
12,000 cps
|
2,000 psi
|
10 sec with UV
|
-40 to 150°C
|
|
703-60
|
Flexible 45 Shore D one component epoxy for eyelet and lens bonding
|
Non-sag paste
|
2,000 psi
|
15 min at 150°C
|
-65 to 160°C
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (MIXED)
|
DENSITY
|
CURE SCHEDULE
|
|---|---|---|---|---|
|
UV 9014**
|
Optically clear moisture resistant needle bonder
|
5,000 cps
|
9.2 Lb/Gal
|
1-3 sec. at 100 mW/cm2
|
|
UV 9019V**
|
Flexible high impact resistant needle bonder
|
4,000 cps
|
9.2 Lb/Gali
|
5-10 sec. at 100 mW/cm2
|
|
200-51
|
Highest viscosity needle epoxy
|
30,000 cps
|
1.7
|
30 min. at 100°C
25 min at 125°C |
|
200-51 TS
|
Higher thixotropy version of 200-51
|
24,000 cps
|
1.3
|
30 min. at 100°C
25 min at 125°C |
TYPICAL APPLICATIONS
- Power Supplies
- Transformers
- Sensors
PRODUCTS
- One and Two Component Epoxy
- Two Component Silicone Adhesive
- UV Curable
| PRODUCT | DESCRIPTION | VISCOSITY (MIXED) | HARDNESS/ COLOR |
GEL/CURE TIME | MIX RATIO (pbw) |
|---|---|---|---|---|---|
|
703-73 A/B
|
Low viscosity marine electronics fast curing epoxy
|
5,000 cps
|
38 D/Black
|
4 min/ 3 hrs
@ 25°C |
100:75
|
|
704-93 A/B
|
Equal mix low viscosity RT cure epoxy for electronics
|
11,000 cps
|
70 D/Dark Gray
|
60 min/ 24 hrs @ 25°C
|
100:100
|
|
504-83 A/B
|
Low viscosity thermally conductive two part silicone
|
16,000 cps
|
60 A/Gray
|
5 hrs/ 3 hrs
@ 65°C |
100:100
|
|
505-07 A/B
|
Equal mix blush free potting compound pending UL approval
|
25,000 cps
|
82 D/Black
|
45 min/ 24 hrs @ 25°C
|
100:100
|
|
505-06 FR
|
General one component potting compound pending UL
|
45,000 cps
|
85 D/Black
|
10 min
@ 177°C |
N/A
|
|
UV 9052 A/B
|
Two part dual cure general potting UV with good adhesion to metal, glass, and plastic
|
150
|
85 D/Clear
|
UV + RT
|
100:100
|
|
501-5A/600-46B
|
Glossy black UL 94V-O low viscosity RT cure epoxy for electronics and PC boards |
5,000 cps
|
85 D/Glossy Black
|
1 hr/ <8 hrs
@ 25°C |
100:25
|
|
SP 2059 A/ 600-72 B
|
UL 94V-O low viscosity RT cure epoxy for electronics
|
14,500 cps
|
85 D/White
|
45 min/ 24 Hr @ 25°C
|
100:11
|
|
702-96 A/ 600-80 B
|
UL 94V-O low viscosity heat cure epoxy for electronics
|
9,000 cps
|
80 D/Black
|
24 hr/ 1hr
@ 100°C |
100:15
|
|
400-64 A/ 600-09 B
|
RT cure UL 94V-O medium viscosity thermally conductive epoxy
|
180,000 cps
|
92 D/Black
|
45 min/ 20 hrs @ 25°C
|
100:30
|
|
505-06 FR
|
General one component potting compound pending UL approval
|
45,000 cps
|
85 D/Black
|
10 min
@ 177°C |
N/A
|
|
505-07 A/B
|
Equal mix blush free potting compound pending UL approval
|
25,000 cps
|
82 D/Black
|
45 min/ 24 hrs
|
100:100
|
|
SP 2001A/ 600-72 B
|
UL 94V-O low viscosity potting compound
|
8,000 cps
|
85 D/Black
|
45 min/ 24 hrs @ 25°C
|
100:12
|
|
400-87 A/B
|
Ultra fast curing equal mix epoxy with low viscosity and low shrinkage
|
12,000 cps
|
75 D/Clear
|
75 sec/ 7 min @ 25°C
|
100:100
|
TYPICAL APPLICATIONS
- Magnet to Shell/Rotor
- Gel Banding
- Balancing
PRODUCTS
- One and Two Component Epoxy
- One Component Induction Curable Epoxy
- Surface Activated Reactive Acrylic
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY
|
LAP SHEAR (AL/AL)
|
CURE SCHEDULE
|
OPERATING TEMP
|
|---|---|---|---|---|---|
|
400-76-1
|
High strength low stress one component epoxy
|
100,000 cps
|
5,900 psi
|
30 min at 150°C
|
-40 to 180°C
|
|
AC 109/SVF
|
Two component surface activated acrylic
|
12,000 cps
|
2,500 psi
|
1 min at 25°C
|
-54 to 150°C
|
|
502-09
|
High temperature resistant one component epoxy
|
Paste
|
3,100 psi
|
30 min at 160°C
|
-40 to 220°C
|
|
502-61
|
Toughened and flexible 54 Shore D epoxy
|
Paste
|
4,930 psi
|
12 min at 150°C
|
-65 to 160°C
|
|
702-80-1
|
Non-metallic filled one component epoxy
|
Paste
|
4,000 psi
|
20 min at 150°C
|
-40 to 200°C
|
|
702-98
|
Induction curable one component epoxy
|
Paste
|
3,200 psi
|
2 min at 150°C
|
-40 to 200°C
|
|
704-39
|
Fast curing version version of 702-98
|
Paste
|
3,200 psi
|
2 min at 150°C
|
-40 to 200°C
|
|
704-08
|
Medium viscosity epoxy for gel banding
|
140,000 cps
|
2,500 psi
|
4 min at 150°C
|
-40 to 180°C
|
|
PRODUCT
|
DESCRIPTION
|
VISCOSITY (MIXED)
|
HARDNESS/COLOR
|
GEL/CURE TIME
|
MIX RATIO (A:B)
|
|---|---|---|---|---|---|
|
505-82 A/B
|
Low viscosity potting compound with excellent adhesion to a variety of substrates
|
7,500 cps
|
70 D/Black
|
110 min / 24 hrs at 25°C
|
1:1 pbv
|
|
702-96 A/ 600-80 B
|
UL 94V-O low viscosity heat cure epoxy for electronics
|
9,000 cps
|
80 D/Black
|
24 hrs. /1 hr at 100°C
|
‘100:15 pbw
|
|
400-64-1A FR / 600-09 B
|
RT cure UL 94V-O medium viscosity thermally conductive epoxy
|
190,000 cps
|
92 D/Black
|
45 min. / 20 hrs at 25°C
|
‘100:3 pbw
|
Solar
| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity cP (5.0 s-1) | Application Method |
|---|---|---|---|---|---|
| Conductive Ribbon/Stringer Attach Adhesives |
|||||
| DB-1538-2 | 2 part, 2 min @180˚C cure | 2 x 10-4 | 50 | 11,000 | Meter-mix Dispense |
| DB-1541-S3 | Lower silver content (lower cost) than DB-1541-S with same reliability, conductivity |
1 x 10-4 | 0 | 10,000 | Needle Dispense |
| DB-1548-1 | High shear strength, moderate Tg Conductivity stability on tin and tin-silver ribbon |
3 x 10-4 | 60 | 10,000 | Needle Dispense |
| CA-100 | High Tg conductive adhesive developed for glass backed thin film stringing applications. Good damp heat stability on molybdenum |
4 x 10-4 | 110 | 20,000 | Needle Dispense |
| Low Cost Conductive Adhesives |
|||||
| CA-105 | Low cost, high Tg, good damp heat stability on tin, silver and OSP treated copper |
3 x 10-4 | 135 | 11,000 | Needle Dispense |
| CA-141 | Low cost version of DB-1541-S series. Flexible, low Tg |
2 x 10-4 | 10 | 20,000 | Needle Dispense |
| CA-148 | Low cost jettable version of DB-1541-S, moderate Tg/flexibility |
4 x 10-4 | 30 | 10,000 | Jet Dispense |
| CA-161 | Low cost, moderate Tg material for ribbon stringing applications |
2 x 10-4 | 50 | 12,000 | Needle Dispense |
| CA-175 | Snap cure, low cost, medium modulus | 2 x 10-4 | 130 | 18,000 | Needle Dispense |
| DB-1590 | Low cost, fast/snap cure. Designed for ribbon stringing for crystralline silicon or thin film cells |
2 x 10-4 | 15 | 20,000 | Needle Dispense |
| Low Temperature Cure Conductive Adhesives |
|||||
| DB-1541-LTC | Low temperature cure version (100C) for organic PV and other temperature sensitive modules |
2 x 10-4 |
50 | 17,000 | Needle Dispense |
| CA-180 | Low temperature cure ( cured 15 minutes at 800C), snap cure at 1500C plus (2 seconds @ 2000C) |
6 x 10-5 | 50 | 12,000 | Needle Dispense |
| Product | Description | Resistivity (ohm•cm) | Tg (˚C) Tan Delta |
Viscosity cP (5.0 s-1) | Application Method |
|---|---|---|---|---|---|
| Conductive Adhesives for Back Contact Applications |
|||||
| DB-1541 | Flexible, high peel strength, Damp heat stability on tin and OSP treated copper. Designed to cure during EVA lamination |
1 x 10-4 | 13 | 33,000 | Stencil Print |
| DB-1588-1 | Lowest cost, flexible, excellent damp heat performance on OSP treated copper. |
4 x 10-4 | 5 | 30,000 | Stencil Print |
| DB-1588-2 | Low cost, flexible, excellent damp heat performance on OSP treated copper. Lowest cost. |
4 x 10-4 | 5 | 30,000 | Stencil Print |
| DB-1588-3 | Needle dispensible or jet version of DB-1588-4 | 2 x 10-4 | 0 | 20,000 | Needle Dispense, Jet |
| DB-1588-4 | Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants |
2 x 10-4 | 0 | 35,000 | Stencil Print |
| DB-1588-5 | Slower cure for longer laminations | 2 x 10-4 | 0 | 35,000 | Stencil Print |
| DB-1588-6 | Designed for jet or needle dispensing | 3 x 10-4 | -15 | 11,000 | Jet Dispensing |
