EMS 702-80-200K

EMS

Nonmetal filled, non-sag epoxy ,

 High bond strength

IC Assembly

PCB Assembly

Conductive ink

Beige

224,000

(Method ;TP107 SP7/10rpm)

Temp (121◦C) = 30 min

Temp (150◦C) = 20 min

Temp (176◦C) = 5 min

EMS 703-60

EMS

Flexible 45 Shore D one component epoxy for eyelet and lens bonding

IC Assembly

PCB Assembly

Conductive ink

Gray

Non-sag paste

Temp (121◦C) = 30 min

Temp (160◦C) = 15 min

Temp (177◦C) = 6 min

EMS

535-10M-1

EMS

•UV/Heat curable adhesive

•Low shrinkage during cure

•High chemical resistance

•Good electrical properties 

IC Assembly

PCB Assembly

Conductive ink

Transparent

0.5rpm: 400,000 

5.0rpm: 80,000 

 (Method :CPE51)

Temp (110◦C) = 30 min

Temp (120◦C) = 10 min

Temp (130◦C) = 5 min

EMS

631-188-3

EMS

•Dual cure adhesive 

•High Tg

•Fix components in place quickly

•Low shrinkage/stress

Camera

Module and Electronics Bonding

White

1.9 S-1 : 123,000cP

1.9 S-1 :40,000 cP

UV: 350 mW/cm2 30 sec

Temp.  120◦C = 60mins

EMS

503-80

EMS

•High temperature resistance

•Excellent cure depth

•Exceptional Thermal

Stability

Magnet motors

Joint Tubes Loudspeaker

Filter End Cap 

Black

Thixotropic

Temp (121◦C) = 10 min

Temp (150◦C) = 2 min

Temp (175◦C) = 1 min

EMS

505-25

EMS

•Excellent shock resistance

•Semi-glossy epoxy encapsulant

•Flame retardant (UL 94)

 •No additional mixing

COB Glob Top Encapsulant applications.

-

1 rpm :110,000 

10 rpm:75,000

(Method TP#107

Spindle #29)

Temp (110◦C) = 10 min

Temp (160◦C) = 5 min

EMS

408-30

EMS

•Excellent shock resistance

•Semi-glossy epoxy encapsulant

•Flame retardant (UL 94)

 •No additional mixing

COB Glob Top Encapsulant applications.

Black

75,000

Temp (110◦C) = 10 min

Temp (160◦C) = 5 min

DE7510S

EMS

•Silicone Fill Encapsulant

COB Glob Top Encapsulant applications.

Clear

750

Temp (150◦C) = 30 min

DE7520S

EMS

•Silicone encapsulant

COB Glob Top Encapsulant applications.

White

Thixotropic

Temp (150◦C) = 30 min

505-73 Red

EMS

•Wide variety of substrates

•Excellent cure depth

•Tough

•Long term performance

To ensure the long term performance of the bonded joint

Red

0.1 rpm ;550,000 cP

1.0 rpm ;180,000 cP

(TP #125)

Temp (100◦C) = 10 min

Temp (110◦C) = 5 min

Temp (120◦C) = 3 min

400-34HF

EMEI

•Flexible epoxy adhesive

•Halogen free < 600 ppm

•Low volatile < 0.1%

IC Assembly

PCB Assembly

Conductive ink

Gray solid

130,000 – 170,000

Temp (120◦C) = 135 min

Temp (150◦C) = 60 min

408-14

EMEI

•Glob Top Epoxy

•Flame retardant

•Semi-glossy

COB Assembly

PCB Assembly

Black

50,000 – 60,000 

Temp (100◦C) = 90 min

Temp (120◦C) = 30 min

Temp (150◦C) = 15 min

RS-1188

EMEI

•Good adhesion

plastics ceramic

•Relay sealant

Black

45,000 - 50,000

Temp (110◦C) = 60 min

Temp (120◦C) = 30 min

Temp (150◦C) = 20 min

ARALDITE® 2011

ARALDITE

Multi-purpose, Long working life, Low shrinkage Good resistance to dynamic loading 

•Bonding a wide variety of metals, ceramics, glass, rubber, rigid plastics and most other materials in common use.

Pale yellow

100

420

30-45

ARALDITE® 2012

ARALDITE

•Fast curing

•Self-levelling

•Bonds multiple metals and plastics

• Resistant to dynamic loads

•Bonding various electronic

component: magnet, metal core battery 

•Fixing various sensor in car industry

Pale yellow

6

20

30

ARALDITE® 2014-2

ARALDITE

•High temperature and chemical resistance

•Very resistant to water and to a wide variety of chemicals

•Gap filling, non-sagging up to 5mm thickness

•KIWA approval (drinking water)

•Bonding of filter media to end cap

•Assembly of electronic fuses

•Bonding of composite pipes in marine

•Potting of connectors

•Bonding of railway insulation rods

Grey paste

110

300

Thixotropic

ARALDITE® 2015-1

ARALDITE

•Resistant to dynamic loading

•Bonds dissimilar substrates

•High gap-filling property

•Resistant to weathering

•High fracture toughness

•Good fatigue performance

•Transportation: Car truck Train

•Marine assembly

•Machinery & electronic

•Wind blade component assembly

Beige paste

45

240

Thixotropic

ARALDITE®

AW106/Hardener

HV 953 U

ARALDITE

•Multi-purpose

• Long working life

• Low shrinkage

• Good resistance to dynamic loading

• Bonds a wide variety of materials in common use

•Araldite 2011 in 1 kg kit and 20 kg pail packing size. 

Pale yellow

100 

420

30-45

ARALDITE®

AW136H / Hardener HY 991 

ARALDITE

•Good performance up to 90°C

• Suitable for bonding metals and some plastics

• Viscous liquid adhesive

•Grinding Wheel assembly.

Grey

55 - 70

480

20 – 30

Araldite® 

AV 138M-1 / Hardener HV 998-1

ARALDITE

• Excellent chemical resistance

•Temperature resistant to 140°C 

•Thixotropic, gap filling paste

•Industrial & Gas Pipe bonding.

•Grinding wheel assembly for automotive industry.

Rubber roller bonding for printing industry.

Grey

30

240

Thixotropic

286 A/B

EMEI

•Thermally Conductive

•Structural Adhesive

•IC Assembly

•PCB Assembly

•Conductive ink

White

30 

240

Paste

400-64-1A FR/600-9B

EMEI

•Thermally conductive potting epoxy

•IC Assembly

•PCB Assembly

•Conductive ink

Black

40

16-24 hr

60-90

2001A/H1    

EMEI

•Suitable potting 

•Fire resistant

•Good dielectric properties

•Low shrinkage

•IC Assembly

•PCB Assembly

Black

30 

180

8 - 10

Epocast 3150/HEP50

Rand Polyproduct

•Potting 

•Encapsulating 

•IC Assembly

•PCB Assembly

Clear-Pale Liquid

-

-

2

Enbond 203/HEP41

Rand Polyproduct

•Bonding 

Oil filter

Pale yellow

20-30

24 hr. 

3-5

EW6626

Colltech

•Bonding; glass, Al, STS, PC, PCB

•IC Assembly

•PCB Assembly

•General Industry

White

120

240

23

EW6657

Colltech

•Potting of optical

components and other 

•Bonding; glass, Al, STS, PC, PCB

•Good flowability

•Fast thermal curing.

•General Industry

Clear

60

- 

11