TEP 60

APAO

• High SAFT

• Good adhesion on low energy substrate 

Light yellow color

14,000

145 ◦C

190 – 220 ◦C

KIZEN XCELL

EVA

• Quick setting and good thermal stability

• Sealing paperboard boxes, folding case and cartons,

boxboards,

White pellet

1100 @ 170 ◦C

110 ◦C

130-180 ◦C

THERMELT

159 Natural

PA

• Short setting and open time

• Good flexibility, 

• Good wetting   

• Good chemical resistance 

Clear amber

3200 – 4000

@205 ◦C

 167-180 °C.

-

THERMELT

195 Natural

PA

• Flammability UL94 : V2

• Molding of electronic components

• LPM applications

White pellet

4000 –5000

@232 ◦C

197-204 °C.

-

SG6641

PU

• Fast fixture, high green strength 

• Excellent bonding on varies of substrates

• Solvent-free 

White to light yellow

8000 @ 130 ◦C

120-140 °C.

-

THERMELT  858 Back

PA

• Flammability UL94 : V0

• Molding of electronic components

• Enhanced UV resistance VS  Std. PA

Black pellet

4000 – 6000

@220 ◦C

175-185 ◦C

210-230 ◦C

THERMELT  867 

PA

• Flammability UL94 : V0

• Molding of electronic components

 White

pellets

3000 – 4000

@220 ◦C

175-190 ◦C

210-230 ◦C

THERMOGRIP 9487

PA

• Long open time

• Excellent adhesion to olefin substrates

-

7,090 @ 300°F

3,780 @ 325°F

2,530 @ 350°F

1,760 @ 375°F

98°F

325 - 350°F