COINING manufactures solder preforms, including popular gold tin preforms, that are used for joining applications in microelectronics packaging and assembly. COINING is the largest solder preform manufacturer in the world, as measured by both sales volume and units shipped. COINING has the most extensive library of solder preform dies in the industry, with about 15,000 different tools on the shelf, ready to make your parts COINING also is a leading producer of gold, aluminum and copper bonding wire as well as jumper chips, bonding pads, tabs, heat sinks, lead frames, solder spheres and cover assemblies for the microelectronics industry.

Solder Preforms

Used for attaching electronic circuitry, packaging electronic devices, providing good thermal and electrical conductivity, and providing an interface for electronic connections.

Metal Microstampings

Used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages.

Aluminum Wire and Ribbon

Used in microelectronics devices as an electrical interconnect, either between a chip and substrate or between two chips.

Gold Wire and Ribbon

Gold wire in diameters as small as 0.0005 inch (12.5 microns), with highly uniform elongation, tensile strength and dimensional properties

More Informations : www.ametek-coining.com