COINING’s Kovar Single Clad Copper Bond Pads are used in high-reliability applications. Within the clad are two different pieces, and the substrate in the middle. Kovar is the substrate with a thin copper clad layer. The copper layer (the bottom layer) is used to solder to a circuit board. The Kovar layer is used to attach a bond wire, typically stainless-steel wire or gold wire. Our Kovar Single Clad Copper Bond Pads are the intermediary piece to attach to both wire and a circuit board.

Advantages

• Solderable on one side
• Laserwire bondable on the other side
• High reliability
• Biocompatible
• Durable
• Environmental resistance
• Visual differentiation between top and bottom
• Ease of automated packaging
• Cost effective
• Flexibly made in different shapes and sizes

Material Specification

• Kovar : Mil-I-23011 or ASTM F-15
• Copper : CDA 101/102
• Sizing : -
• Dimensions : 0.025 inches by 0.25 inches minimum up to 1 inch by 1 inch square
• Thickness : 0.005 inches up to 0.020 inches overall
• Applications : Implantable devices, RF/ Microwave, Military, Aerospace

How it’s made

Our Kovar Single Clad Copper Bond Pads are made through the cladding process. Once cladded, it goes through the stamping process, resulting in the finished product. .